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Dr. JACOB ELIAS

Professor

School of Engineering

Cochin University of Science and Technology
Kochi - 682022, Kerala, India

E-mail-

jacob@cusat.ac.in



BRIEF BIO
Total Experience of 32 years. Now working as the Professor in Mechanical Engineering. Also the Chief Placement Office of CUSAT and Nodal Officer for Kerala Job Portal.

RESEARCH INTERESTS
Thermal Engineering

RESEARCH PROFILES
Scopus : https://www.scopus.com/authid/detail.uri?authorId=55919327800
Google Scholar : https://scholar.google.com/citations?user=Z5zh9gIAAAAJ&hl=en#d=gs_hdr_drw

JOURNAL PUBLICATIONS (RECENT) [TOTAL PUBLICATIONS : 15]
  • Investigations on the Corrosion Properties of Sn–0.5 Cu–Bi–xAg Lead Free Solder Alloys in 3.5% NaCl Solution, Transactions on Electrical and Electronic Materials, The Korean Institute of Electrical and Electronic Material Engineers (KIEEME) 2020

  • An Experimental Investigation on the Properties of Two Novel Ternary Solder Alloys Sn–0.5 Cu–3Bi and Sn–1Cu–1Ni Replacing Lead, Physics of Metals and Metallography, Vol. 120, 2020

  • Experimental Investigation on the Effect of Ag Addition on Ternary Lead Free Solder Alloy–Sn–0.5 Cu–3Bi, Metals and Materials International, Vol. 26, 2020

  • Experimental Investigations on Impact Toughness and Shear Strength of Lead Free Solder Alloy Sn–0.5 Cu–3Bi–xAg, Transactions on Electrical and Electronic Materials, Vol. 21, 2020

  • CFD simulation for evaluation of optimum heat transfer rate in a heat exchanger of an internal combustion engine, International Journal for Simulation and Multidisciplinary Design Optimization, Vol. 11, 2020

  • Experimental and finite element analysis on determining the fatigue life of pb-free solder joint (Sn-0.5 Cu-3Bi-1Ag) used in electronic packages under harmonic loads, International Journal of Modeling, Simulation, and Scientific Computing, World Scientific Publishing Company 2020

  • Factorial design and design of experiments for developing novel lead free solder alloy with Sn, Cu and Ni, International Journal for Simulation and Multidisciplinary Design Optimization, Vol. 11, 2020

  • Investigations on the properties of new lead free solder alloy composition–Sn-0.5 Cu-3.5 Bi, Materials Today: Proceedings, Vol. 21, 2020

  • Fuel efficiency enhancement by addition of nano sized magnetised ferro particles in cooling system of internal combustion engines, Journal of Advanced Research in Fluid Mechanics and Thermal Sciences, Vol. 67, 2020

  • Experimental Investigations on Impact Toughness and Shear Strength of Novel Lead Free Solder Alloy Sn-1Cu-1Ni-XAg, Powder Metallurgy Progress, Sciendo Vol. 19, 2019

  • CONFERENCE PUBLICATIONS (RECENT) [TOTAL PUBLICATIONS : 1]
  • Recurrence quantification analysis applied to sequential speckle images of machined surface for detection of chatter in turning, Interferometry XIV: Applications, Proc. of SPIE Vol. 7064, 2008

  • BOOKS PUBLISHED
  • Dr. JACOB ELIAS, Jayesh S, A study on Lead free solder alloy, LAP LAMBERT Academic Publishing, 2019

  • PATENT
  • LEAD FREE SOLDER ALLOY TIN-COPPER-BISMUTH-SILVER - Published,2019

  • LEAD FREE SOLDER ALLOY FOR MODERATELY HIGH TEMPERATURE APPLICATIONS - Published,2019